Reactive Ion Etching (RIE)

Reactive Ion Etching (RIE):

• Reactive Ion Etching (RIE) Advanced Vacuum 320 with 4 gas lines (Argon, Oxygen, CHF₃ and CF₄) and a large chamber hosting up to 12” wafers.
• The system is suited for the etching steps of resist-based lithographies (optical or electron) on Silicon.

Contact Person/Responsibles: Dr. Gian Carlo Gazzadi, Dr. Claudia Menozzi

Ownership: CNR

Funding Agency: Fondazione Cassa di Risparmio di Modena

Ongoing/Active Collaborations:

• The instrument works as a facility for CNR-NANO and FIM
  

University Strategic Lines:

• Part of NANOFAB Lab, CNR-NANO